詳情說明
新型的硅片用頂齒組，各齒件分別安裝到安裝基座，各齒件在安裝到安裝基座之前，作為形成用于容納硅片的頂齒槽的外表面處在外側(cè)，各齒件的外表面必須被拋光加工至表面粗糙度為 ra0.1um 以下。因此，新型的硅片用頂齒組，能夠提高頂齒和硅片接觸的表面的光滑程度，從而降低硅片表面被劃傷的風險。
A new tvoe of iop tooth aroup for slicon waters. each tooth comoonent is insta ed on the instalaton base separatel. Berore instalatioron the instalation base, the outer surface of each tooth component, which forms the top tooth groove for accommodating silicon wafersis located on the outer side. The outer surface of each tooth component must be polished to a surface roughness of ra0.1 u Below mTherefore, the new type of top teeth for slicon wafers can improve the smoothness of the surtace in contact between the top teeth and thesilicon water. therebv reducina the risk of scratches on the surlace of the silicon waler
周生
